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XCZU3EG-2SFVC784I AMD Xilinx

2025-04-27

Series

Zynq® UltraScale+™ MPSoC EG

Part Status

Active

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 600MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

784-BFBGA, FCBGA

Supplier Device Package

784-FCBGA (23x23)

Number of I/O

252

Base Product Number

XCZU3


Resource TypeLink
Datasheets

Zynq UltraScale+ MPSoC Overview

Zynq UltraScale+ MPSoC Overview

UltraScale™ Architecture Product Overview

Environmental InformationXilinx REACH211 Cert
PCN Design/SpecificationAll product New AMD Logo 13/May/2024


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